Job Responsibilities
Lab Rework & Repair
- Perform rework and repair activities on FT extender, Si reball, and wireless module boards.
Equipment Operation & Maintenance
- Operate and troubleshoot lab equipment including xVT systems, ovens, testers, and related hardware.
- Perform machine conversion and setup according to engineering instructions.
- Conduct preventive maintenance, calibration, and VOSCAL activities on xVT and associated equipment.
- Maintain lab hardware assets including sockets, tester components, robots (AIShield), and machine collaterals.
- Report equipment health issues and coordinate with vendors for defective part replacement.
Testing & Diagnostics
- Perform tester diagnostic procedures and test flow calibration.
- Conduct xVT path-loss calibration and machine validation activities.
- Execute first-level troubleshooting using multimeter and oscilloscope.
- Support engineering Design of Experiments (DOE), including data collection and basic analysis.
Inventory & Material Management
- Manage component and unit inventory for NPI and High Volume Manufacturing (HVM) projects.
- Track unit allocation for engineering validation, DOE, and qualification activities.
- Perform inventory cycle counts, database updates, and reconciliation.
- Support scrapping processes and maintain proper lab storage organization.
- Manage system updates in ISM, Icatch, LabMIR, and ISMP for unit transfers and shipment tracking.
- Handle incoming and outgoing shipments, including documentation and coordination with stores.
Documentation & Reporting
- Maintain operational logs, daily lab activity reports, and equipment status records.
- Document repair history, request logs, and process changes.
- Provide status updates and reports to engineering teams and stakeholders.
Compliance & Lab Support
- Ensure adherence to ESD standards and lab safety procedures.
- Track lab assets and maintain proper equipment records.
- Communicate effectively with internal stakeholders, engineers, and vendors.
- Conduct component-level soldering, including micro-components down to 0102 size.
- Replace underneath-pad components such as Power Amplifiers, BGAs, and QFNs using reflow equipment with proper temperature profiling.
- Ensure surrounding components are protected and not damaged during the rework process.
- Perform precision board rework and soldering using appropriate lab tools and equipment.
Requirements:
- Diploma/Advanced Diploma in Electrical/Electronic Engineering, Physics, or related fields.
- Strong communication and multitasking skills.
Pay: RM2,000.00 - RM2,300.00 per month
Application Question(s):
- What is your expected salary?
- What is your notice period?
- Are you willing to work shift?
Location:
Work Location: In person